MediaTek Unveils First 2nm Mobile Chip Ahead of Qualcomm

HSINCHU, Taiwan — MediaTek Inc. has unveiled the Dimensity 9600 Pro, the first mobile chipset manufactured using Taiwan Semiconductor Manufacturing Co.’s (TSMC) highly anticipated 2-nanometer N2P process technology. The launch gives Taiwan’s chipmaker a first-mover advantage over San Diego-based Qualcomm Inc. in the competition to dominate next-generation mobile silicon.

The processor uses a customized “All Big Core” CPU architecture with a 2+3+3 cluster configuration. MediaTek has bypassed traditional low-power efficiency cores in favor of high-performance cores, a strategy it pioneered to maximize raw computational throughput. The company says the 2nm N2P process enables a 61 percent reduction in multi-core power consumption compared with its previous-generation flagship.

TSMC’s N2P process moves beyond the current 3-nanometer standard through gate-all-around (GAA) nanosheet transistors and advanced backside power delivery network layouts. The architecture allows chip designers to pack more transistors into a smaller footprint while optimizing power distribution. On the Dimensity 9600 Pro, single-core speeds increase by 17 percent and multi-core processing performance rises by 15 percent.

MediaTek’s adoption of the node follows a roadmap established a year ago, when the chipmaker joined other major industry players, including Intel Corp. and Advanced Micro Devices Inc. (AMD), in committing to TSMC’s next-generation manufacturing technology. Apple Inc. also recently confirmed at its “Surprise and Shine” launch event that its newly unveiled iPhone 18 lineup will run entirely on TSMC-fabricated 2-nanometer processors.

The Dimensity 9600 Pro is designed for on-device generative artificial intelligence as well as conventional mobile computing. Its dual-NPU architecture connects graphics processing unit (GPU) operations with dedicated AI computing units, while a proprietary Agentic AI Engine is designed to run complex, multi-step autonomous AI agents directly on smartphones without relying on cloud-based servers.

Qualcomm is widely expected to introduce its own TSMC 2nm N2P-based silicon, the Snapdragon 8 Elite Gen 6, at an industry event scheduled for next week. MediaTek’s launch comes as both companies compete for placement in the next wave of premium Android smartphones.

The new chipset also targets high-end mobile gaming. It delivers a 27 percent increase in peak gaming performance, an 18 percent improvement in real-time hardware raytracing capabilities, and a 24 percent reduction in power consumption during peak gaming loads. Its integrated image signal processor supports ultra-high-definition video capture at up to 4K resolution at 120 frames per second.

Qualcomm has historically dominated the premium, high-margin flagship device segment, while MediaTek has been the world’s leading manufacturer of mobile chipsets by volume, supplying silicon for high-volume mid-range and budget devices. In recent quarters, MediaTek has expanded its market value and premium footprint through design wins with Samsung Electronics, Xiaomi, Oppo, Motorola, and Realme.

The Dimensity 9600 Pro represents the apex of that premium push, with MediaTek aiming to challenge Qualcomm’s historical dominance in high-end computing performance.